JPS6318652A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6318652A
JPS6318652A JP16303286A JP16303286A JPS6318652A JP S6318652 A JPS6318652 A JP S6318652A JP 16303286 A JP16303286 A JP 16303286A JP 16303286 A JP16303286 A JP 16303286A JP S6318652 A JPS6318652 A JP S6318652A
Authority
JP
Japan
Prior art keywords
lead frame
pellet
lead
semiconductor device
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16303286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582981B2 (en]
Inventor
Tetsuro Okatome
岡留　哲朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16303286A priority Critical patent/JPS6318652A/ja
Publication of JPS6318652A publication Critical patent/JPS6318652A/ja
Publication of JPH0582981B2 publication Critical patent/JPH0582981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49506—Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16303286A 1986-07-11 1986-07-11 半導体装置の製造方法 Granted JPS6318652A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16303286A JPS6318652A (ja) 1986-07-11 1986-07-11 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16303286A JPS6318652A (ja) 1986-07-11 1986-07-11 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6318652A true JPS6318652A (ja) 1988-01-26
JPH0582981B2 JPH0582981B2 (en]) 1993-11-24

Family

ID=15765889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16303286A Granted JPS6318652A (ja) 1986-07-11 1986-07-11 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6318652A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653400A (ja) * 1992-07-28 1994-02-25 Nec Corp リードフレーム
KR19980067079A (ko) * 1997-01-31 1998-10-15 이대원 트랜지스터용 리드프레임 제조방법
USRE38704E1 (en) 1995-06-26 2005-02-15 Matsushita Electric Industrial Co., Ltd. Optical disk recording method employing a plurality of recording areas and apparatus therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421262A (en) * 1977-07-18 1979-02-17 Daiakon Inc Method of producing electronic part package and device used therefor
JPS6095941A (ja) * 1983-10-31 1985-05-29 Toshiba Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421262A (en) * 1977-07-18 1979-02-17 Daiakon Inc Method of producing electronic part package and device used therefor
JPS6095941A (ja) * 1983-10-31 1985-05-29 Toshiba Corp 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653400A (ja) * 1992-07-28 1994-02-25 Nec Corp リードフレーム
USRE38704E1 (en) 1995-06-26 2005-02-15 Matsushita Electric Industrial Co., Ltd. Optical disk recording method employing a plurality of recording areas and apparatus therefor
USRE41469E1 (en) 1995-06-26 2010-08-03 Panasonic Corporation Optical disk recording method employing a plurality of recording areas and apparatus therefor
KR19980067079A (ko) * 1997-01-31 1998-10-15 이대원 트랜지스터용 리드프레임 제조방법

Also Published As

Publication number Publication date
JPH0582981B2 (en]) 1993-11-24

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees